TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD acquired Xintec, Inc., a transaction completed in January 2007, structured as equity purchase.
Xintec, Inc. operates in Wafer-level packaging / CMOS image sensor back-end, is based in Taiwan. In January 2007 TSMC acquired a 51.2% equity interest in Xintec, Inc., a supplier of wafer-level packaging services, to support its CMOS image sensor manufacturing business. Xintec listed on the Taipei Exchange in March 2015; after IPO dilution TSMC held approximately 41.0% of Xintec as of February 28, 2026.
Secures wafer-level packaging capacity to support TSMC's CMOS image sensor manufacturing.
Majority-owned back-end packaging affiliate (later diluted to a minority stake post-IPO)
In January 2007, we acquired a 51.2% equity interest in Xintec, a supplier of wafer level packaging service, to support our CMOS image sensor manufacturing business. In March 2015, Xintec listed its shares on the Taipei Exchange.TSMC FY2025 Form 20-F, Item 4 Business
Advisory firms were not disclosed for this transaction.